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Hydra-LF-305 T3-T6 - Sn96.5.Ag3.Cu0.5 ultra-low voiding lead-free water-soluble solder paste 3% silver SAC305 (REL0) F manufacturers can minimize BGA solder

Hydra-LF-305 T3-T6 - Sn96.5.Ag3.Cu0.5 ultra-low voiding lead-free water-soluble solder paste 3% silver SAC305 (REL0) F manufacturers can minimize BGA solder

Name: Hydra-LF-305 T3-T6 - Sn96.5.Ag3.Cu0.5 ultra-low voiding lead-free water-soluble solder paste 3% silver SAC305 (REL0) F manufacturers can minimize BGA solder
Brand: www.coronastickers.nu
SKU: 64044564654
Price: 16.32 USD
Availability: InStock
Rating: 4.6768 (17 reviews)

SKU: 64044564654

4.7

USD16.32 USD39.32

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Ships within 48 hours · Estimated delivery Aug 20 - Aug 25

Live Spec

Hydra-LF-305 T3-T6 - Sn96.5.Ag3.Cu0.5 ultra-low voiding lead-free water-soluble solder paste 3% silver SAC305 (REL0) F manufacturers can minimize BGA solderHydra LF 305 Sn96. 5. Ag3. Cu0. 5 SAC305 lead free water soluble ultra low voiding REL0 solder paste 3% Silver with QC Aid optical tracer for instant visual QC IPC Designation REL0 (cleaned) Lead free BGA, CSP, QFN, LGA Low voiding. Low mid chip bidding. Clear residue. Long stencil life. Rolling well on the blade Sharp printing definition at high speeds Instant wetting on most PCB finishes Easy to clean using warm DI water, IPA, solvents, water based

Store: www.coronastickers.nu · Domain: www.coronastickers.nu

Description

manufacturers can minimize BGA solder sphere slumping and improve the reliability of their electronic products

Low mid-chip bidding

- Long stencil life

Suspends BGA spheres creating a perfect activation environment for soldering leaded or lead-free solder balls or SMD solder paste - all-purpose flux

Exchange/Return Notes