Sn10Pb88Ag2 High-Temp Solder Paste • 290°C Die Attach • Aerospace RMA • RMA-HT-010 Size:100g syringe visually noticeable while wicking the

visually noticeable while wicking the workspace regardless of the alloy leaded or lead-free

The "Ge" Advantage: Germanium micro-additives prevent dross formation and oxidation

the flux can adequately perform also for any other soldering task

EASY SOLDERING & DESOLDERING: Implements upgraded booster for copper ions

Sn10Pb88Ag2 High-Temp Solder Paste • 290°C Die Attach • Aerospace RMA • RMA-HT-010 Size:100g syringe visually noticeable while wicking theAerospace & Defense Grade High Temperature Solder Paste RMA HT 010 is a high reliability, Rosin Mildly Activated (RMA) solder paste engineered for extreme thermal environments. Utilizing the Sn10Pb88Ag2 alloy (2% Silver), this paste features a high melting point of 290C, making it the industry standard for semiconductor attachment and complex multi step PCB assemblies. Key Technical Advantages Extreme Thermal Stability: Formulated with increased